22 | 08 | 2017
 
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DEMA Electronic AG
ARIES | Test & Burn-In Sockets, High Temp, Adapters
Aries Electronics - Test and Burn-In

Your Best Source for Interconnection & Packaging Solutions!

Aries Electronics, incorporated in 1972, is the recognized industry leader in ZIF (Zero-Insertion-Force)
Test Sockets for DIP, PGA, PLCC, and SOIC devices, and continues to be a significant source for a wide variety of specialty electronic connectors.

In recent years, the company has made major inroads in the market for high-temperature sockets and flexible cable products. The addition of the Correct-A-Chip® product line established the company as a major source for “intelligent connectors” adapters (connectors that allow the use of one termination style on a board designed for a different termination style)

Most recently, the company has developed and patented several concepts for BGA (ball grid array) and
LGA (land grid array) sockets, and has acquired a high-frequency test and burn-in socket line, furthering growth in the test socket market.
 

CSP/µBGA Test & Burn-In Socket for BGA, LGA, QFN, QFP, MLF, LCC & CSP Devices up to 55mm Square    Chip Scale Test & Burn In Sockets
(CSP Micro BGA LGA DSP SRAM DRAM QFN QFP BGA LCC MLF Flash etc.,
Any SMT device;
0.3 mm pitch & up) 
High-Temp 23026HT CSP Burn-in & Test Sockets   High Temperature Test & Burn In Sockets
(CSP Micro BGA LGA DSP SRAM DRAM QFN QFP BGA LCC MLF Flash etc.,
Any SMT device;
0.3 mm pitch & up; 200°C to 300°C )
National MM58274CV 20-Pin PLCC-to-16-Pin DIP Converter – RoHS-Compliant   IC Adapters "Correct-A-Chip"
Modules, Standard & Custom (Proto and Production Volumes.
Standard & Custom IC Modules)

 
Test and Burn-In Products from Aries:

Link to

- ARIES Electronics / Test Solutions 

Product News

- Universal 23024 Open Top Socket
- Kelvin Test Socket
- Fine Pitch Bump Adapters
- Socket 23017 Adjustable Preasure Pad
- ARIES Switch a Pitch Adapter

PDF Download

- ARIES Test and Burn-In Overview
- ARIES CSP Test Socket Explanation
- FAQ: BGA and CSP Socket Explanation

ARIES Product Shortform
ARIES Product
Selection Webguide
1 Low Cost Correct-A-Chip™ Adapters - ARIES
2 Correct-A-Chip™ Adapters - ARIES
3 High-Temperature Sockets - ARIES
4 BGA, µBGA, LGA, QFN, QFP, MLF, LCC & CSP Sockets and Adapters - ARIES
5 Zero-Insertion-Force (ZIF) Test Sockets - ARIES
6 High-Frequency (RF) Test Sockets - ARIES
7 LED / LCD Display Sockets - ARIES
8 DIP / SIP Sockets and Headers - ARIES
9 PGA & other Sockets - ARIES
10 Programming Devices - ARIES
11 Tools & Accessories - ARIES

ARIES | Test- and Burn-In Product News Flash
0 2mm-probes
TEST & BURN-IN

"Kontaktierung von Rastermaß 0.2mm nun auch möglich"

ARIES hat neue "Spring Probes" Kontakte entwickelt die jetzt auch die Test & Burn-In Kontaktierung von Bauteilen mit bis zu 0.2mm Rastermaß möglich machen.

Die Kontakte ermöglichen neue Test & Burn-In Sockellösungen für viele Bauteile die bisher
nicht
oder nur mit großem Aufwand kontaktierbar waren. Die neuen Kontakte für 0.2mm
Rastermaß sind wie gewohnt entweder als "pointed–tip" oder "crown-shaped" verfügbar.

- Cycles: >100k
- Material: Gold-plated Beryllium-Copper
- Temperatur: -55°C to +155°C

Auch sind sie für High-Frequenzy (RF) Sockellösungen von 10 GHz und mehr einsetzbar.

Übersicht: BGA, µBGA, LGA, QFN, QFP, MLF, LCC & CSP Test Sockel
Übersicht: High-Frequency (RF) Test Sockel
Hersteller: ARIES - Test & Burn-In

Für Fragen oder weitere Informationen.
DEMA Electronic AG